AI has become a key driver for the semiconductor industry as it is applied to ever more aspects of daily life. Many startups and established vendors are designing AI chips to accelerate algorithms and ...

Sixteen miles north of Albuquerque, in Rio Rancho, New Mexico, an Intel chip plant sits on more than 200 acres of land. The site was established in the 1980s, part of it built on top of a sod farm. In ...

Apple is planning to overhaul its chip design for the 2026 iPhones, in a move that could mark the first time it uses advanced multi-chip packaging in a mobile device. It sounds complicated, but here’s ...

Artificial intelligence (AI) is reshaping the semiconductor landscape-both as a fast-growing end market and as a catalyst for innovation across mobile, automotive, networking, industrial and beyond.

Samsung’s upcoming Exynos 2700 processor is getting a complete structural redesign focused heavily on thermal management. According to supply chain rumors, the new layout will physically separate the ...

Next year's iPhone 18 will use TSMC's next-generation 2-nanometer fabrication process in combination with an advanced new packaging method, and the world's leading pure-play foundry has reportedly ...

Apple's imminent M5 Pro and M5 Max chips will run cooler and faster than ever before, as a year-old rumor about the way Apple Silicon chips are packaged resurfaces. Apple is anticipated to bring out ...

The relentless march of semiconductor scaling continues to reshape the packaging landscape, driven by Moore’s Law and the demand for higher performance in increasingly compact form factors [1]. Over ...

Researchers at the National Institute of Standards and Technology (NIST) have developed a new way to package photonic integrated circuits — tiny chips that convey information using light instead of ...