TSMC is rumored to build new CoWoS advanced packaging plants in the US and Japan due to 'persistently strong demand'. TSMC to ...

Grand Process Technology Company (GPTC), a Taiwan-based semiconductor equipment company involved in the supply chain for TSMC ...

To put this in context, as we reported last week, Nvidia just surpassed Apple and Microsoft in terms of market cap - that ...

TSMC's 5nm and 3nm production lines are 'fully loaded' until 1H 2025 due to 'strong orders' for AI chips, Qualcomm + MediaTek ...

Earlier this year, TSMC was forced to halt construction work at its CoWoS (Chip-on-Wafer-on-Substrate) advanced semiconductor ...

A recent annual forum for the chipmaking equipment and materials sectors was hosted in Tainan, southern Taiwan, bringing ...

Originally, the industry rumor mill expected TSMC's CoWoS capacity expansion to start leveling off by 2026. Early projections had the company's monthly packaging volume topping out around 100,000 ...

Taken together, TSMC's upcoming entry into 2nm, combined with its proprietary advanced CoWoS packaging technology's mission-critical role in AI developments, underscores an impending upward re ...

What Happened: TSMC’s CoWoS (Chip-on-Wafer-on-Substrate) advanced packaging is experiencing a surge in demand, particularly from AI chip manufacturers and cloud service providers, reported CNA.

The firm agrees with Camtek’s assessment that CoWoS remains a key bottleneck and expects visibility to improve as TSMC (TSM) alleviates this. The firm, which believes the stock can recapture higher ...

The Department of Commerce sent a letter to TSMC imposing export restrictions on certain sophisticated chips, of 7 nanometer or more advanced designs, destined for China that power AI accelerator ...