Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...
Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) ...
A research team in Italy developed a PVT-driven heat pump system for domestic hot water production that combines packed-bed latent heat storage with sensible thermal storage to better balance supply ...
Manage thermal challenges in compact, power-dense electronics using multiphysics simulation. Learn to predict heat transfer, ...
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