CHARLOTTE, N.C. — The IC design and test community's quest to achieve fewer than 100 defective parts per million (DPPM) is becoming more difficult as process technologies move below 100 nanometers.
Several vendors are ramping up new inspection equipment based on infrared, optical, and X-ray technologies in an effort to reduce defects in current and future IC packages. While all of these ...
To compete in the fast-growing market for automotive ICs, semiconductor companies need to address new challenges across the entire design flow. To meet the ISO 26262 goal of zero defective parts per ...
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