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Electronic Design
1m
Broadcom Bets on 3.5D Packaging Technology to Build Bigger AI Chips
The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.
Hosted on MSN
8m
Upcoming Sequel to Beloved PS2 Game Getting Free Demo
The Lost Hero, a sequel to the beloved PS2 game, is getting a free demo. It will be available for PS4 and PS5 tomorrow, ...
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