Engineered for Scale with ASUS, Powered by RDMA, CXL 2.0, and 400G Networking 3TB–8TB Memory Appliances and 100G/400G ...

Intel CEO Lip-Bu Tan announces 15% job cuts and cancels expansion plans as the company refocuses on core products, cost ...

The leap to Windows 11 was the perfect time to ready for the era of artificial intelligence, say Datacom and Intel.

Sandisk Corporation (NASDAQ: SNDK) today announced the formation of a Technical Advisory Board to guide the development and strategy of its groundbreaking High Bandwidth Flash (HBF™) memory technology ...

“Despite Beijing pouring significant subsidies into its domestic semiconductor industry, China cannot produce chips capable ...

Intel Corporation INTC is scheduled to report its second-quarter 2025 earnings on July 24, after the closing bell. The Zacks ...

What is CMOS 2.0? At its core, CMOS 2.0 is an effort to move beyond the limitations of a single monolithic die. Rather than ...

TSMC may be exploring foundries for Chip-on-Wafer-on-Substrate (CoWoS) technology. This advanced packaging technology, developed by TSMC 3DFabric, is crucial for major tech companies seeking to boost ...

Stability AI and AMD have released an optimized Stable Diffusion 3 Medium model that runs locally on laptops with new Ryzen ...

LG Electronics is redefining portable performance with the expansion of its acclaimed LG gram lineup. The newest LG gram Pro ...

Breakthrough CMOS chip integrates quantum light sources and control electronics, marking a major step in scalable quantum photonic systems.