TSMC is rumored to build new CoWoS advanced packaging plants in the US and Japan due to 'persistently strong demand'. TSMC to ...

TSMC's 5nm and 3nm production lines are 'fully loaded' until 1H 2025 due to 'strong orders' for AI chips, Qualcomm + MediaTek ...

What Happened: TSMC’s CoWoS (Chip-on-Wafer-on-Substrate) advanced packaging is experiencing a surge in demand, particularly from AI chip manufacturers and cloud service providers, reported CNA.

Amkor Technology's advanced packaging leadership and partnership with TSMC are key growth drivers, targeting a $37 per share price within a year. AMKR's expansion in Korea, Vietnam, and a new ...

With AI showing no signs of slowing, TSMC will be ramping up its advanced chip packaging capabilities over the next few years. During its recent earnings call on October 17, the chipmaker revealed ...

Amkor Technology Inc.’s plans for its $2 billion Peoria advanced packaging facility are “progressing well,” the Tempe ...

So confident in its foundry business Chipzilla is so confident about its foundry business it is outsourcing more work to its ...

Thirteen plaintiffs have filed a class action lawsuit against TSMC, alleging discriminatory hiring practices against non-East Asian individuals. TSMC denied the claims, emphasizing its commitment to ...

Amkor Technology Inc. and TSMC have signed a memorandum of understanding to collaborate and bring advanced packaging and test capabilities to Arizona, further expanding the region’s semiconductor ...

Taken together, TSMC's upcoming entry into 2nm, combined with its proprietary advanced CoWoS packaging technology's mission-critical role in AI developments, underscores an impending upward re ...

To put this in context, as we reported last week, Nvidia just surpassed Apple and Microsoft in terms of market cap - that ...

Chinese semiconductor shares rise as TSMC halts advanced chip shipments: Summary Chinese semiconductor stocks surged as the U.S. ordered Taiwan Semiconductor Manufacturing Co. (TS ...