A recent technical paper titled “Factors determining bond wave speed in wafer bonding” was published by researcher at ...

Edge AI, GenAI, and next-gen communications are adding more workloads to phones that are already under pressure to deliver ...

Broad Range of Potential Attacks: If an attacker is able to gain access to data on an Ethernet connection, a range of attacks ...

Siemens has unveiled its Questa One functional safety solution, setting a new standard in the verification and validation of ...

Multi-die assemblies enable more analog content, but that adds new security vulnerabilities for which there is little ...

Tailoring security subsystems to unique application requirements.

Today, we are witnessing a paradigm shift towards a more modular design approach that disaggregates SoC functions into ...

Smart glasses with augmented reality functions look more natural than VR goggles, but today they are heavily reliant on a ...

Software-defined products and custom silicon; finFET stress deformation; testing AI data center networks; European ...

How to put the pieces together in a complex design with AI is an unsolved problem.

Using horizontal integration with virtual electronic control units (vECUs), test automation, and continuous integration.

Loss Integration of High-Density Polymer Waveguides with Silicon Photonics for Co-Packaged Optics” was published by ...