Indium Corporation, a globally recognized refiner, smelter, manufacturer, and supplier of advanced materials, has officially announced the worldwide release of WS-910 Flip-Chip Flux—a water-soluble ...

Integrating liquid-metal packaging into a SiC half-bridge power module is an innovative solution to longstanding challenges.

NVIDIA’s 800 VDC architecture represents the next generation of power systems, purpose-built to deliver efficient and reliable energy for the megawatt-scale computing infrastructure of the future.

onsemi has announced its collaboration with NVIDIA to accelerate the transition toward 800 Volts Direct Current (VDC) power architectures—a transformative evolution that is delivering remarkable ...

Powering the semiconductor future through collaboration, innovation & sustainability. SEMI tackles talent gaps, supply chains & net-zero goals while driving AI, quantum, and packaging tech.

Insights from an Exclusive Interview with Cem Basceri, CEO of Qromis. The world of power electronics is constantly evolving due to the ongoing demand for improved performance and efficiency in ...

This year, Bosch took advantage of the PCIM event to assert its ambition to secure a significant position in the SiC market.

Infineon’s Marijana Vukicevic discusses the evolving role of MCUs in high-performance motor control and power conversion applications.

SiC MOSFETs in a high-power LLC DC/DC converter stage enable a 30% space savings while achieving stable operation and high efficiency.

GaN power devices have gained prominence in medium- and high-power applications due to their ability to operate at high frequencies while maintaining excellent efficiency.

Changan Automobile has introduced what it claims to be the world’s first commercial gallium nitride (GaN)-based on-board charger (OBC) technology platform, integrated into the newly launched Qiyuan ...

2024 has been a crucial year for the power electronics sector in terms of development, preparing for radical changes in 2025 and beyond.