The paper, “Efficient 3D Chiplet Stacking Using TSMC-SoIC®,” describes how Alchip used a third-party EDA tool to overcome four complex technical challenges. In the paper, Erez Shaizaf, Alchip’s Chief ...

The paper,“Efficient 3D Chiplet Stacking Using TSMC-SoIC®,” describes how Alchip used a third-party EDA tool to overcome four complex technical challenges. In the paper, Erez Shaizaf ...

The paper, "Efficient 3D Chiplet Stacking Using TSMC-SoIC®," describes how Alchip used a third-party EDA tool to overcome four complex technical challenges. In the paper, Erez Shaizaf ...

and Small Outline Integrated Circuits (SOIC) which provide it an additional competitive advantage. These technologies enhance the performance and efficiency of AI chips, giving TSMC a critical ...

For the next two years, Nvidia and AMD have secured TSMC's advanced packaging capacity for CoWoS and SoIC technologies, indicating that the giant companies are offering TSM a reliable market ...

Apple is reportedly one of TSMC's first clients of its new 2nm process node, making its A19 Pro chip for the iPhone 17, and its new M5 chip with SoIC advanced packaging (SoIC = Small Outline ...

According to rumors, the M5 chip will differ from previous Apple chips by switching to TSMC’s SoIC technology. SoIC packaging allows chips to be developed in a 3D structure instead of 2D. This ...

Wafer-on-wafer bonding is a component of 3D packaging, which includes TSMC’s SoIC technology. SoIC is a technology that unites adjacent chips with various features in a bulge-free bonding structure ...

TL;DR: Taiwan's technology protection rules prevent TSMC from producing advanced 2nm chips overseas to keep cutting-edge technology at home. TSMC plans to start volume production of its 2nm chips ...

PHOENIX (AZFamily) — More than a dozen current and former employees of Taiwan Semiconductor Manufacturing Company (TSMC) have joined a class-action lawsuit against the chips-making giant ...

Each low-numerical aperture (NA) extreme ultraviolet (EUV) lithography system costs over US$100 million, making it one of the most expensive semiconductor manufacturing tools in history.