News

MILPITAS, CA – Global semiconductor manufacturing equipment sales will reach $125.5 billion this year, up 7.4% year-over-year, according to SEMI’s mid-year report. Growth is being fueled by AI demand ...
PEACHTREE CITY, GA – JULY 22, 2025 – The exhibition floor space is almost sold out for this year’s PCB West, the largest exhibition and conference for printed circuit board design, fabrication and ...
Abstracts of 100-500 words and speaker biographies should be submitted to PCEA. Papers and presentations must be noncommercial in nature and should focus on technology, techniques or methodologies ...
A step-down PCB is simply a multilayer PCB whose board thickness is reduced (stepped down) in a few places. The step-down is ...
SUNNYVALE, CA – Synopsys has officially completed its acquisition of Ansys, finalizing a deal first announced in January of last year. The move combines Synopsys’ strengths in silicon design and IP ...
SANTA ANA, CA – TTM Technologies has announced the acquisition of a 750,000 sq. ft. facility in Eau Claire, WI, and land rights for a new manufacturing site in Penang, Malaysia.
Global wrist-worn device shipments rose 10.5% year-over-year in Q1 2025, driven by strong demand across key regions, with Huawei, Xiaomi, and Apple leading the market, according to IDC.
Yole Group forecasts the advanced IC substrate market to reach $31B by 2030, fueled by AI, glass core substrates, and demand for complex high-performance packaging.
GBM finalizes Lincstech acquisition to boost AI server PCB capabilities, expanding operations in Singapore and Malaysia to support growth in advanced tech sectors.
Austin, Texas – High Density Packaging User Group (HDP) is pleased to announce that Lincstech Co., Ltd. (Lincstech) has become a member. “Lincstech has been supporting the electronics industry with ...
Worldwide chip sales rose 27% in May 2025 to $59 billion, with strong growth led by the Americas and Asia Pacific, per SIA.